Conall Daly

For an Engineering Materials class project I chose to write a report on the materials science and manufacturing that goes into integrated circuits. I chose this topic as at the time I had heard about the Extreme Ultra-Violet Lithography techniques being developed by ASML to continue the progress of shrinking transistor sizes. In this research project, I explored the intersection of materials science and semiconductor technology, delving into Moore’s Law and the challenges it presents to the advancement of computer chips. This project exemplifies my ability to independently research unfamiliar areas and develop a deep understanding of complex technical topics. Key aspects of my work included:

  • Self-Directed Learning: Developed expertise in semiconductor materials, fabrication techniques, and failure mechanisms by reviewing academic literature, industry reports, and technical standards.
  • Materials Science Analysis: Gained an understanding of silicon’s electronic band structure, doping methods, and lattice defect impacts, linking these to transistor performance.
  • Advanced Manufacturing Techniques: Investigated processes like the Czochralski method for crystal growth, ion implantation for doping control, and the limits of lithographic patterning at nanoscales.
  • Reliability and Failure Analysis: Researched failure mechanisms, including electromigration and dielectric breakdown, and proposed strategies for improving the durability of electronic devices.
  • Sustainability and Recycling: Evaluated the environmental impact of semiconductor manufacturing and recycling, highlighting innovations in precious metal recovery and e-waste management.
  • Emerging Technologies: Explored novel advancements, such as single-atom transistors and carbon nanotube-based field-effect transistors, as potential pathways to extend computational progress.